Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels

The heat flow density is constantly increasing due to the growing demand for integration and compaction of electronic devices. A sintered thin flat pipe (TFHP) a typical device managing flux highly integrated circuits. Four different structures vapor–liquid channel architecture are designed in this work. Heat transfer performance tests TFHPs carried out thermal powers. surface temperature distribution resistance TFHP under operating conditions investigated. experimental results show that design significantly impacts TFHP’s wedge-shaped wick better suited channel. has lowest 0.28 °C/W most elevated maximum power 22 W. dispatch improved.